High-density Inclined Fin Cover
A high thermal conductivity dual liquid-cooled heat sink comprises a heat dissipation substrate and a plurality of fins disposed on the heat dissipation substrate, with adjacent fins spaced apart. It is characterized in that one or more fins are bent toward the spacing side, and the bent edges overlap or closely cover the top opening of the spacing.
Advantages: Through the synergistic operation of dual cooling paths, the thermal load of a single liquid cooling path can be significantly reduced, markedly enhancing overall heat dissipation efficiency to meet the cooling demands of medium-to-high power density equipment.